SS13T&R
vs
SBR1U30CSP-7
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
CONTINENTAL DEVICE INDIA LTD
|
DIODES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW POWER LOSS, TR, 11 INCH: 5000
|
|
| Application |
EFFICIENCY
|
|
| Breakdown Voltage-Min |
30 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.55 V
|
|
| JEDEC-95 Code |
DO-214AC
|
|
| JESD-30 Code |
R-PDSO-C2
|
R-XBCC-N2
|
| Non-rep Pk Forward Current-Max |
30 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Reference Standard |
IATF 16949; MIL-STD-750
|
|
| Rep Pk Reverse Voltage-Max |
30 V
|
30 V
|
| Reverse Current-Max |
200 µA
|
|
| Reverse Test Voltage |
30 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
|
| Terminal Form |
C BEND
|
NO LEAD
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
X2-WLB1406-2, 2 PIN
|
| JESD-609 Code |
|
e2
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
Tin/Copper (Sn/Cu)
|
|
|
|
Compare SS13T&R with alternatives
Compare SBR1U30CSP-7 with alternatives