SST26VF064BA-104I/TD vs S25FL064A0LNFI000 feature comparison

SST26VF064BA-104I/TD Microchip Technology Inc

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S25FL064A0LNFI000 Spansion

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SPANSION INC
Package Description TBGA-24 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 50 MHz
JESD-30 Code R-PBGA-B24 R-PDSO-G16
Length 8 mm 10.3 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 24 16
Number of Words 67108864 words 8388608 words
Number of Words Code 64000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64MX1 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Screening Level TS 16949
Seated Height-Max 1.2 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 7.5 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
JESD-609 Code e3
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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