SST39VF020-90-4C-B3KE vs SST37VF020-90-3C-WH feature comparison

SST39VF020-90-4C-B3KE Microchip Technology Inc

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SST37VF020-90-3C-WH Silicon Storage Technology

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SILICON STORAGE TECHNOLOGY INC
Part Package Code BGA TSOP1
Package Description 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 8 X 14 MM, MO-142BA, TSOP1-32
Pin Count 48 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
JESD-30 Code R-PBGA-B48 R-PDSO-G32
JESD-609 Code e1 e0
Length 8 mm 12.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE NOR TYPE
Width 6 mm 8 mm
Base Number Matches 1 2
Command User Interface NO
Data Polling NO
Package Equivalence Code TSSOP32,.56,20
Standby Current-Max 0.000015 A
Supply Current-Max 0.02 mA
Toggle Bit NO

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