SST39VF801C-70-4I-B3KE-T
vs
SST39VF801C-70-4I-B3KE
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.1.A
|
3A991.B.1.A
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
4 Weeks
|
28 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Access Time-Max |
70 ns
|
70 ns
|
Additional Feature |
BOTTOM BOOT BLOCK
|
BOTTOM BOOT BLOCK
|
Boot Block |
BOTTOM
|
BOTTOM
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
Data Retention Time-Min |
100
|
100
|
Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
JESD-609 Code |
e1
|
e1
|
Length |
8 mm
|
8 mm
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Sectors/Size |
1,2,1,15
|
1,2,1,15
|
Number of Terminals |
48
|
48
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX16
|
512KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
TFBGA
|
Package Equivalence Code |
BGA48,6X8,32
|
BGA48,6X8,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Sector Size |
8K,4K,16K,32K
|
8K,4K,16K,32K
|
Standby Current-Max |
0.00002 A
|
0.00002 A
|
Supply Current-Max |
0.03 mA
|
0.03 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
BGA
|
Package Description |
|
6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB1,TFBGA-48
|
Pin Count |
|
48
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare SST39VF801C-70-4I-B3KE-T with alternatives
Compare SST39VF801C-70-4I-B3KE with alternatives