STM32F071V8T7TR
vs
STM32F071VBH6XXX
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active Unconfirmed
|
| Package Description |
Lfqfp,
|
Vfbga,
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
3A991.A.2
|
3A991.a.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.25
|
| Factory Lead Time |
13 Weeks
|
|
| Has ADC |
Yes
|
Yes
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
Yes
|
Yes
|
| Clock Frequency-Max |
32 Mhz
|
32 Mhz
|
| DAC Channels |
Yes
|
Yes
|
| DMA Channels |
Yes
|
Yes
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G100
|
S-PBGA-B100
|
| JESD-609 Code |
e4
|
|
| Length |
14 Mm
|
7 Mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
87
|
87
|
| Number of Terminals |
100
|
100
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
Yes
|
Yes
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
LFQFP
|
VFBGA
|
| Package Shape |
Square
|
Square
|
| Package Style |
Flatpack, Low Profile, Fine Pitch
|
Grid Array, Very Thin Profile, Fine Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
|
| RAM (bytes) |
16384
|
16384
|
| ROM (words) |
65536
|
131072
|
| ROM Programmability |
Flash
|
Flash
|
| Seated Height-Max |
1.6 Mm
|
0.6 Mm
|
| Speed |
48 Mhz
|
48 Mhz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
3.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
Gull Wing
|
Ball
|
| Terminal Pitch |
0.5 Mm
|
0.5 Mm
|
| Terminal Position |
Quad
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
Not Specified
|
|
| Width |
14 Mm
|
7 Mm
|
| uPs/uCs/Peripheral ICs Type |
Microcontroller, Risc
|
Microcontroller, Risc
|
| Base Number Matches |
1
|
1
|
|
|
|