SY58603UMGTR
vs
NB6L11SMNR2G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ONSEMI
|
| Part Package Code |
DFN
|
QFN16, 3x3, 0.5P
|
| Package Description |
HVSON,
|
QFN-16
|
| Pin Count |
8
|
16
|
| Manufacturer Package Code |
MLF
|
485G-01
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B.1
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CAN ALSO OPERATE WITH 3.3V SUPPLY
|
|
| Family |
58603
|
6L
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-PDSO-N8
|
S-XQCC-N16
|
| JESD-609 Code |
e4
|
|
| Length |
2 mm
|
3 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
8
|
16
|
| Number of True Outputs |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
0.35 ns
|
0.45 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL GOLD PALLADIUM
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
2 mm
|
3 mm
|
| fmax-Min |
2500 MHz
|
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
35 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Package Equivalence Code |
|
LCC16,.12SQ,20
|
| Prop. Delay@Nom-Sup |
|
0.45 ns
|
| Same Edge Skew-Max (tskwd) |
|
0.025 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SY58603UMGTR with alternatives
Compare NB6L11SMNR2G with alternatives