SYS32256LK-12 vs DPS256X32WA-25C feature comparison

SYS32256LK-12 Mosaic Semiconductor Inc

Buy Now Datasheet

DPS256X32WA-25C B&B Electronics Manufacturing Company

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC DPAC TECHNOLOGIES CORP
Part Package Code SIMM SIMM
Package Description , ,
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 25 ns
JESD-30 Code R-XSMA-N64 R-XSMA-N64
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 256KX32 256KX32
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form NO LEAD NO LEAD
Terminal Position SINGLE SINGLE
Base Number Matches 1 1
Additional Feature USER CONFIGURABLE AS 1M X 8
Alternate Memory Width 16
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL

Compare SYS32256LK-12 with alternatives

Compare DPS256X32WA-25C with alternatives