TBJD475K050CSLT0H00
vs
CWR11NH475KB
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
AVX CORP
|
KEMET ELECTRONICS CORP
|
| Package Description |
, 2917
|
CHIP
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.21.00.50
|
8532.21.00.80
|
| Capacitance |
4.7 µF
|
4.7 µF
|
| Capacitor Type |
TANTALUM CAPACITOR
|
TANTALUM CAPACITOR
|
| Dielectric Material |
TANTALUM (DRY/SOLID)
|
TANTALUM (DRY/SOLID)
|
| ESR |
1500 mΩ
|
1500 mΩ
|
| Height |
2.8 mm
|
2.8 mm
|
| JESD-609 Code |
e0
|
e0
|
| Length |
7.3 mm
|
7.3 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR, 13 Inch
|
TR, EMBOSSED PLASTIC, 7 INCH
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
| Reference Standard |
MIL-PRF-55365/8
|
MIL-PRF-55365/8
|
| Size Code |
2917
|
2917
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn90Pb10)
|
| Terminal Shape |
J BEND
|
J BEND
|
| Width |
4.3 mm
|
4.3 mm
|
| Base Number Matches |
1
|
4
|
| Additional Feature |
|
ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ
|
| Leakage Current |
|
0.0024 mA
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Ripple Current |
|
126.4 mA
|
| Tan Delta |
|
0.06
|
|
|
|
Compare TBJD475K050CSLT0H00 with alternatives
Compare CWR11NH475KB with alternatives