TC4023BP vs HCC4093BF feature comparison

TC4023BP Toshiba America Electronic Components

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HCC4093BF STMicroelectronics

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown not_compliant
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Length 19.25 mm 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 380 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
HTS Code 8542.39.00.01
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 380 ns
Schmitt Trigger YES

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Compare HCC4093BF with alternatives