TC4S66FU vs BU4S66G2-TL feature comparison

TC4S66FU Toshiba America Electronic Components

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BU4S66G2-TL ROHM Semiconductor

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TOSHIBA CORP ROHM CO LTD
Part Package Code SSOP
Package Description TSSOP, TSSOP5/6,.08 ,
Pin Count 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
Input Voltage-Max 18 V
Input Voltage-Min
JESD-30 Code R-PDSO-G5
Length 2 mm
Normal Position NO
Number of Channels 1
Number of Functions 1
Number of Terminals 5
On-state Resistance-Max (Ron) 950 Ω
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Switch-off Time-Max 80 ns
Switch-on Time-Max 120 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm
Base Number Matches 4 1

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