TC55RP3001EZB713 vs TC55RP3001EZB feature comparison

TC55RP3001EZB713 Telcom Semiconductor Inc

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TC55RP3001EZB Microchip Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TELCOM SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description TO-92, 3 PIN , SIP3,.1,50
Reach Compliance Code unknown unknown
Dropout Voltage1-Max 0.7 V
Input Voltage-Max 10 V
JESD-30 Code O-PBCY-W3
Number of Functions 1
Number of Terminals 3 3
Output Current1-Max 0.15 A 0.08 A
Output Voltage1-Max 3.06 V
Output Voltage1-Min 2.94 V
Output Voltage1-Nom 3 V 3 V
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BCY
Package Shape ROUND
Package Style CYLINDRICAL
Qualification Status Not Qualified Not Qualified
Regulator Type FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form WIRE
Terminal Position BOTTOM SINGLE
Base Number Matches 2 2
Rohs Code No
Part Package Code TO-92
Pin Count 3
ECCN Code EAR99
HTS Code 8542.39.00.01
Adjustability FIXED
Dropout Voltage1-Nom 0.18 V
Input Voltage Absolute-Max 12 V
JESD-609 Code e0
Line Regulation-Max 0.054%
Load Regulation-Max 0.09%
Number of Outputs 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code SIP3,.1,50
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 1.27 mm
Voltage Tolerance-Max 1%

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