TC55V16176FF-133 vs HM6AEB18202BPL50 feature comparison

TC55V16176FF-133 Toshiba America Electronic Components

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HM6AEB18202BPL50 Renesas Electronics Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code QFP BGA
Package Description LQFP, QFP100,.63X.87 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
Pin Count 100 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.2 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B165
JESD-609 Code e0 e0
Length 20 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type CACHE SRAM DDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LBGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.46 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.38 mA
Supply Voltage-Max (Vsup) 3.465 V 1.9 V
Supply Voltage-Min (Vsup) 3.135 V 1.7 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1 mm
Terminal Position QUAD BOTTOM
Width 14 mm 15 mm
Base Number Matches 1 1
Pbfree Code No

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