TC7107CLW
vs
TC7106IKW
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PLASTIC, LCC-44
|
QFP, QFP44,.52SQ,32
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2 V
|
3.35 V
|
| Analog Input Voltage-Min |
0.2 V
|
2.7 V
|
| Converter Type |
ADC, DUAL-SLOPE
|
A/D CONVERTER
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQFP-G44
|
| JESD-609 Code |
e0
|
e3
|
| Linearity Error-Max (EL) |
0.0122%
|
|
| Negative Supply Voltage-Nom |
-5 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
13
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Equivalence Code |
LDCC44,.7SQ
|
QFP44,.52SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
1.8 mA
|
1.8 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
44
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Length |
|
10 mm
|
| Moisture Sensitivity Level |
|
1
|
| Output Format |
|
PARALLEL, WORD
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
2.45 mm
|
| Width |
|
10 mm
|
|
|
|
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