TC7116CKW713
vs
TC7116CPL
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
DIP
|
Package Description |
QFP, QFP44,.57SQ,32
|
PLASTIC, DIP-40
|
Pin Count |
44
|
40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
6 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Analog Input Voltage-Max |
3.35 V
|
3.35 V
|
Analog Input Voltage-Min |
2.7 V
|
2.4 V
|
Converter Type |
ADC, DUAL-SLOPE
|
ADC, DUAL-SLOPE
|
JESD-30 Code |
S-PQFP-G44
|
R-PDIP-T40
|
JESD-609 Code |
e3
|
e3
|
Length |
10 mm
|
51.97 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Analog In Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
40
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
DIP
|
Package Equivalence Code |
QFP44,.52SQ,32
|
DIP40,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
2.45 mm
|
5.08 mm
|
Supply Current-Max |
1.8 mA
|
1.8 mA
|
Supply Voltage-Nom |
9 V
|
9 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.8 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
10 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TC7116CKW713 with alternatives
Compare TC7116CPL with alternatives