TC74HC00AF(EL) vs MC74HC00AFELG feature comparison

TC74HC00AF(EL) Toshiba America Electronic Components

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MC74HC00AFELG onsemi

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Source Content uid TC74HC00AF(EL) MC74HC00AFELG
Pbfree Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 10.3 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 19 ns 110 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.05 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 5.275 mm
Base Number Matches 1 1
Rohs Code Yes
Package Description SOP, SOP14,.3
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Package Equivalence Code SOP14,.3
Packing Method TR
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO

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