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TC74HC00AFN vs CD54HC132F/3A feature comparison

TC74HC00AFN Toshiba America Electronic Components

Buy Now Datasheet

CD54HC132F/3A Rochester Electronics LLC

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code No No
Part Life Cycle Code End Of Life Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS INC
Part Package Code SOIC DIP
Package Description 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-14 DIP,
Pin Count 14 14
HTS Code 8542.39.00.01
Base Number Matches 1 3
Family HC/UH
JESD-30 Code R-CDIP-T14
JESD-609 Code e0
Logic IC Type NAND GATE
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 188 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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