TC74HC00APF
vs
SN54HC00J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TOSHIBA CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
HERMETIC SEALED, CERAMIC, DIP-14
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.25 mm
19.94 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Prop. Delay@Nom-Sup
19 ns
Propagation Delay (tpd)
95 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
4.45 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Additional Feature
LG-MAX
Compare TC74HC00APF with alternatives
Compare SN54HC00J with alternatives