TC74HC4066AFS vs 74HC4066D feature comparison

TC74HC4066AFS Toshiba America Electronic Components

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74HC4066D NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, 3.90 MM, PLASTIC, SOT-108-1, MS-012, SO-14
Pin Count 16 14
Reach Compliance Code unknown unknown
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G16 R-PDSO-G14
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 16 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 12
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-609 Code e4
Length 8.65 mm
Moisture Sensitivity Level 1
Normal Position NO
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 5 Ω
On-state Resistance-Max (Ron) 142 Ω
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output SEPARATE OUTPUT
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Switch-off Time-Max 45 ns
Switch-on Time-Max 30 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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