TC835C/KW
vs
TC835CKW
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELEDYNE COMPONENTS
|
| Part Package Code |
QFP
|
|
| Package Description |
QFP, QFP44,.5SQ,32
|
|
| Pin Count |
44
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2 V
|
2 V
|
| Analog Input Voltage-Min |
-2 V
|
|
| Converter Type |
ADC, DUAL-SLOPE
|
ADC, DUAL-SLOPE
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
|
| Linearity Error-Max (EL) |
0.005%
|
|
| Moisture Sensitivity Level |
3
|
|
| Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
4
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY CODED DECIMAL
|
BINARY CODED DECIMAL
|
| Output Format |
PARALLEL, 4 BITS
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP44,.5SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.45 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
10 mm
|
|
| Base Number Matches |
1
|
2
|
| Supply Current-Max |
|
3 mA
|
|
|
|
Compare TC835C/KW with alternatives
Compare TC835CKW with alternatives