TD62003AP
vs
MC1413PG
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
ONSEMI
|
Part Package Code |
DIP
|
PDIP-16
|
Package Description |
IN-LINE, R-PDIP-T16
|
DIP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
Toshiba
|
onsemi
|
Additional Feature |
LOGIC LEVEL COMPATIBLE
|
LOGIC LEVEL COMPATIBLE
|
Collector Current-Max (IC) |
500 A
|
0.5 A
|
Collector-Emitter Voltage-Max |
50 V
|
50 V
|
Configuration |
COMPLEX
|
COMPLEX
|
DC Current Gain-Min (hFE) |
1000
|
1000
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e3
|
Number of Elements |
7
|
7
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Polarity/Channel Type |
NPN
|
NPN
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
Tin (Sn)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
VCEsat-Max |
1.6 V
|
|
Base Number Matches |
4
|
1
|
Manufacturer Package Code |
|
648-08
|
HTS Code |
|
8542.39.00.01
|
Operating Temperature-Min |
|
-20 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare TD62003AP with alternatives
Compare MC1413PG with alternatives