TE28F640B3TC70 vs K8D6316UTMPI0700 feature comparison

TE28F640B3TC70 Numonyx Memory Solutions

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K8D6316UTMPI0700 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP TSOP1
Package Description 12 X 20 MM, TSOP-48 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature TOP BOOT BLOCK
Boot Block TOP TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 1
Rohs Code Yes
Alternate Memory Width 8
Moisture Sensitivity Level 2

Compare TE28F640B3TC70 with alternatives

Compare K8D6316UTMPI0700 with alternatives