TGL41-24A
vs
MSPP4KE24AE3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DIOTEC SEMICONDUCTOR AG
|
MICROSEMI CORP
|
| Part Package Code |
DO-213AB
|
DO-41
|
| Package Description |
MELF-2
|
O-PALF-W2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Max |
25.2 V
|
25.2 V
|
| Breakdown Voltage-Min |
22.8 V
|
22.8 V
|
| Breakdown Voltage-Nom |
24 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-213AB
|
DO-204AL
|
| JESD-30 Code |
O-PELF-R2
|
O-PALF-W2
|
| JESD-609 Code |
e1
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
400 W
|
400 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-50 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1.13 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
20.5 V
|
20.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
MATTE TIN
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
5
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare TGL41-24A with alternatives
Compare MSPP4KE24AE3 with alternatives