TJA1050U
vs
TJA1050T/VM,118
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIE
|
SOIC
|
Package Description |
DIE,
|
3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT96-1, SOP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XUUC-N8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD SILVER
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
2
|
1
|
Manufacturer Package Code |
|
SOT96-1
|
Data Rate |
|
1000 Mbps
|
Length |
|
4.9 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Transceivers |
|
1
|
Package Equivalence Code |
|
SOP8,.25
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.75 mm
|
Supply Current-Max |
|
0.075 mA
|
Technology |
|
CMOS
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
3.9 mm
|
|
|
|
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