TLC0820ACDBLE vs ML2261CCP feature comparison

TLC0820ACDBLE Texas Instruments

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ML2261CCP RF Micro Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MICRO LINEAR CORP
Part Package Code SSOP DIP
Package Description SSOP, DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 5.1 V 5.1 V
Analog Input Voltage-Min -0.1 V -0.1 V
Conversion Time-Max 2.5 µs 1.06 µs
Converter Type ADC, FLASH METHOD ADC, FLASH METHOD
JESD-30 Code R-PDSO-G20 R-PDIP-T20
Length 7.2 mm 25.97 mm
Linearity Error-Max (EL) 0.3906% 0.39%
Number of Analog In Channels 1 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Bit Code BINARY BINARY
Output Format PARALLEL, 8 BITS PARALLEL, 8 BITS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Qualification Status Not Qualified Not Qualified
Sample Rate 0.392 MHz
Sample and Hold / Track and Hold TRACK SAMPLE
Seated Height-Max 2 mm 4.32 mm
Supply Current-Max 15 mA 14 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP20,.3
Terminal Finish Tin/Lead (Sn/Pb)

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