TLC5510AINSRG4
vs
ADC1175-50CILQ/NOPB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP24,.3
|
HVQCCN, LCC24,.16X.2,20
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
4 V
|
2.6 V
|
Analog Input Voltage-Min |
|
0.6 V
|
Converter Type |
ADC, FLASH METHOD
|
ADC, RESISTANCE LADDER
|
JESD-30 Code |
R-PDSO-G24
|
R-PQCC-N24
|
JESD-609 Code |
e4
|
e3
|
Length |
15 mm
|
5 mm
|
Linearity Error-Max (EL) |
0.3906%
|
0.7617%
|
Moisture Sensitivity Level |
1
|
3
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
75 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVQCCN
|
Package Equivalence Code |
SOP24,.3
|
LCC24,.16X.2,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
20 MHz
|
50 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
TRACK
|
Seated Height-Max |
2 mm
|
0.8 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
5.3 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TLC5510AINSRG4 with alternatives
Compare ADC1175-50CILQ/NOPB with alternatives