TLC7524ID
vs
MX7528KEWP+T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
| Part Package Code |
SOIC
|
20-SOIC_W-300_MIL
|
| Package Description |
GREEN, PLASTIC, MS-012AC, SOIC-16
|
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Analog Output Voltage-Max |
10 V
|
|
| Analog Output Voltage-Min |
-10 V
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
e3
|
| Length |
9.9 mm
|
12.8 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.1953%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP20,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
10 MHz
|
|
| Seated Height-Max |
1.75 mm
|
2.65 mm
|
| Settling Time-Max |
|
0.4 µs
|
| Settling Time-Nom (tstl) |
0.1 µs
|
|
| Supply Current-Max |
2 mA
|
1 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3.9 mm
|
7.5 mm
|
| Base Number Matches |
4
|
1
|
| Manufacturer Package Code |
|
20-SOIC_W-300_MIL
|
| Date Of Intro |
|
1999-05-28
|
|
|
|
Compare TLC7524ID with alternatives
Compare MX7528KEWP+T with alternatives