TLE6250RV33
vs
LU82562V
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
INTEL CORP
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
SOP,
|
BGA,
|
| Pin Count |
8
|
81
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G8
|
S-PBGA-B81
|
| Length |
5 mm
|
10 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
81
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
BGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.815 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
|
| Telecom IC Type |
CAN TRANSCEIVER
|
INTERFACE CIRCUIT
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
4 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare TLE6250RV33 with alternatives
Compare LU82562V with alternatives