TLE6251-3G vs 935302721118 feature comparison

TLE6251-3G Infineon Technologies AG

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935302721118 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP, SOP14,.25 SOP,
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Infineon
Data Rate 1000 Mbps
JESD-30 Code R-PDSO-G14 R-PDSO-G8
Length 8.75 mm 4.9 mm
Moisture Sensitivity Level 2A 1
Number of Functions 1 1
Number of Terminals 14 8
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Current-Max 0.08 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BICMOS
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd) NICKEL PALLADIUM GOLD SILVER
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 4 mm 3.9 mm
Base Number Matches 3 1
JESD-609 Code e4
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Temperature Grade AUTOMOTIVE

Compare TLE6251-3G with alternatives

Compare 935302721118 with alternatives