TLE6251-3G
vs
PI2C3020A
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SOP, SOP14,.25
|
TSSOP, TSSOP48,.3,20
|
| Pin Count |
14
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Infineon
|
|
| Data Rate |
1000 Mbps
|
16000 Mbps
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G48
|
| Length |
8.75 mm
|
12.5 mm
|
| Moisture Sensitivity Level |
2A
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
48
|
| Number of Transceivers |
1
|
1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP14,.25
|
TSSOP48,.3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Supply Current-Max |
0.08 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
Nickel/Gold/Palladium (Ni/Au/Pd)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4 mm
|
6.1 mm
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e0
|
|
|
|
Compare TLE6251-3G with alternatives
Compare PI2C3020A with alternatives