TLE7368-3E
vs
TLE7368E
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
GREEN, PLASTIC PACKAGE-36
|
GREEN, PLASTIC PACKAGE-36
|
| Pin Count |
36
|
36
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Infineon
|
Infineon
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G36
|
R-PDSO-G36
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12.8 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
HSSOP
|
| Package Equivalence Code |
SSOP36,.56
|
SSOP36,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Supply Voltage-Max (Vsup) |
45 V
|
45 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
13.5 V
|
13.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.6 mm
|
7.6 mm
|
| Base Number Matches |
4
|
6
|
|
|
|
Compare TLE7368-3E with alternatives
Compare TLE7368E with alternatives