TLV5632IDWG4
vs
LTC1665CGN
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
LINEAR TECHNOLOGY CORP
|
Part Package Code |
SOIC
|
SSOP
|
Package Description |
SOP, SOP20,.4
|
SSOP, SSOP16,.25
|
Pin Count |
20
|
16
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
5.1 V
|
5.478 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e0
|
Length |
12.8 mm
|
4.8895 mm
|
Linearity Error-Max (EL) |
0.3906%
|
0.3906%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
8
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SSOP
|
Package Equivalence Code |
SOP20,.4
|
SSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
1.727 mm
|
Settling Time-Max |
7 µs
|
|
Settling Time-Nom (tstl) |
3 µs
|
30 µs
|
Supply Current-Max |
21 mA
|
0.73 mA
|
Supply Voltage-Nom |
3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
3.899 mm
|
Base Number Matches |
1
|
4
|
Manufacturer Package Code |
|
GN
|
|
|
|
Compare TLV5632IDWG4 with alternatives
Compare LTC1665CGN with alternatives