TMC2111B2V
vs
TMC2111B2V
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
TRW LSI PRODUCTS INC
|
RAYTHEON SEMICONDUCTOR
|
| Package Description |
DIP, DIP24,.3
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Max Frequency@Nom-Sup |
30000000 Hz
|
|
| Number of Bits |
1
|
|
| Number of Functions |
8
|
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.A.2
|
| Additional Feature |
|
OPTEMP SPECIFIED AS TC
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
30 MHz
|
| External Data Bus Width |
|
8
|
| Low Power Mode |
|
NO
|
| Output Data Bus Width |
|
8
|
| Supply Current-Max |
|
40 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| uPs/uCs/Peripheral ICs Type |
|
DSP PERIPHERAL, PIPELINE REGISTER
|
|
|
|
Compare TMC2111B2V with alternatives
Compare TMC2111B2V with alternatives