TMS28F400BZT80CDBJL
vs
S29AL008J55BFNR13
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SPANSION INC
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
80 ns
|
55 ns
|
Alternate Memory Width |
16
|
8
|
Boot Block |
TOP
|
TOP
|
Command User Interface |
YES
|
YES
|
Data Polling |
NO
|
YES
|
Endurance |
100000 Write/Erase Cycles
|
|
JESD-30 Code |
R-PDSO-G44
|
R-PBGA-B48
|
Length |
28.2 mm
|
8.15 mm
|
Memory Density |
4194304 bit
|
8388608 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
16
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
1,2,1,3
|
1,2,1,15
|
Number of Terminals |
44
|
48
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
512KX8
|
512KX16
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
VFBGA
|
Package Equivalence Code |
SOP44,.63
|
BGA48,6X8,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Power Supplies |
5 V
|
|
Programming Voltage |
12 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.63 mm
|
1 mm
|
Sector Size |
16K,8K,96K,128K
|
8K,4K,16K,32K
|
Standby Current-Max |
0.0000012 A
|
0.000005 A
|
Supply Current-Max |
0.065 mA
|
0.012 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Toggle Bit |
NO
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
13.3 mm
|
6.15 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Package Description |
|
8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
|
Pin Count |
|
48
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Additional Feature |
|
TOP BOOT BLOCK
|
Common Flash Interface |
|
YES
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Ready/Busy |
|
YES
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare TMS28F400BZT80CDBJL with alternatives
Compare S29AL008J55BFNR13 with alternatives