TMS320C6711BGFN150 vs TMS320C6211BGFN167 feature comparison

TMS320C6711BGFN150 Rochester Electronics LLC

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TMS320C6211BGFN167 Texas Instruments

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, PLASTIC, BGA-256 BGA-256
Pin Count 256 256
Reach Compliance Code unknown not_compliant
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width 22 22
Barrel Shifter NO NO
Boundary Scan YES YES
Clock Frequency-Max 149.25 MHz 167 MHz
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4 4
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 220
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.32 mm 2.32 mm
Supply Voltage-Max 2 V 1.89 V
Supply Voltage-Min 1.8 V 1.71 V
Supply Voltage-Nom 1.9 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 2 1
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Bit Size 32
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Equivalence Code BGA256,20X20,50
RAM (words) 4096
Temperature Grade OTHER

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