TMS320C6711GFN-150
vs
TMS320C6711BGFN150
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
27 X 27 MM, PLASTIC, BGA-256
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
22
|
22
|
| Barrel Shifter |
NO
|
NO
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
149.25 MHz
|
149.25 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
90 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
220
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2.32 mm
|
2.32 mm
|
| Supply Voltage-Max |
2 V
|
2 V
|
| Supply Voltage-Min |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom |
1.9 V
|
1.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
|
|
|
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