TMS320F28377DPTPQ
vs
V62/18601-01XF
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
|
| Package Description |
HLQFP-176
|
LFBGA,
|
| Pin Count |
176
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| CPU Family |
TMS320
|
|
| Clock Frequency-Max |
20 MHz
|
100 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
32
|
| JESD-30 Code |
S-PQFP-G176
|
S-PBGA-B337
|
| JESD-609 Code |
e4
|
e0
|
| Length |
24 mm
|
16 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
12
|
12
|
| Number of I/O Lines |
97
|
169
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
176
|
337
|
| Number of Timers |
6
|
|
| On Chip Program ROM Width |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLFQFP
|
LFBGA
|
| Package Equivalence Code |
QFP176,1.0SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
220
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
208896
|
208896
|
| RAM (words) |
204
|
|
| ROM (words) |
524288
|
524288
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.6 mm
|
1.4 mm
|
| Speed |
200 MHz
|
200 MHz
|
| Supply Current-Max |
495 mA
|
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
24 mm
|
16 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TMS320F28377DPTPQ with alternatives
Compare V62/18601-01XF with alternatives