TMUX1309QPWRQ1
vs
TMUX1309QBQBRQ1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2020-07-03
|
2020-08-28
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| Bandwidth-Nom |
500 MHz
|
500 MHz
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-XQCC-N16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
3.5 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
90 dB
|
90 dB
|
| On-state Resistance Match-Nom |
10 Ω
|
10 Ω
|
| On-state Resistance-Max (Ron) |
740 Ω
|
740 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
COMMON OUTPUT
|
COMMON OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP16,.25
|
LCC16,.1X.14,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Signal Current-Max |
0.025 A
|
0.025 A
|
| Supply Current-Max (Isup) |
0.001 mA
|
0.001 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
85 ns
|
85 ns
|
| Switch-on Time-Max |
75 ns
|
75 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
2.5 mm
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
HVQCCN, LCC16,.1X.14,20
|
|
|
|
Compare TMUX1309QPWRQ1 with alternatives
Compare TMUX1309QBQBRQ1 with alternatives