TP0350D11R8TCE
vs
RP73G1J11R8DTDG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ROYAL ELECTRONIC FTY CO LTD
|
TE CONNECTIVITY LTD
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.45 mm
|
0.45 mm
|
| Package Length |
1.6 mm
|
1.55 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.8 mm
|
0.8 mm
|
| Packing Method |
TR, Paper
|
TR, PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.1 W
|
0.1 W
|
| Resistance |
11.8 Ω
|
11.8 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
TP
|
RP73
|
| Size Code |
0603
|
0603
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
|
| Tolerance |
0.5%
|
0.5%
|
| Working Voltage |
75 V
|
75 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Additional Feature |
|
HIGH PRECISION
|
| Manufacturer Series |
|
RP73
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
MIL-STD-202
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare TP0350D11R8TCE with alternatives
Compare RP73G1J11R8DTDG with alternatives