TPD6E001RSFR
vs
BZX384-C5V1,115
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
SOD
|
| Package Description |
QFN-12
|
PLASTIC, SMD, SC-76, 2 PIN
|
| Pin Count |
12
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.50
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Breakdown Voltage-Min |
11 V
|
|
| Clamping Voltage-Max |
15 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
MO-220WGGB
|
|
| JESD-30 Code |
S-PQFP-N12
|
R-PDSO-G2
|
| JESD-609 Code |
e4
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
12
|
2
|
| Operating Temperature-Max |
85 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
5.5 V
|
|
| Reverse Current-Max |
0.001 µA
|
2 µA
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
ZENER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
SOD323
|
| Dynamic Impedance-Max |
|
480 Ω
|
| Power Dissipation-Max |
|
0.3 W
|
| Reference Voltage-Nom |
|
5.1 V
|
| Reverse Test Voltage |
|
2 V
|
| Voltage Temp Coeff-Max |
|
1.2 mV/°C
|
| Voltage Tol-Max |
|
5%
|
| Working Test Current |
|
5 mA
|
|
|
|
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