TPS2062AD
vs
BM92A30MWV-ZE2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROHM CO LTD
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-8
|
UQFN-40
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
ROHM Semiconductor
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
2.7 V
|
|
| JESD-30 Code |
R-PDSO-G8
|
S-XQCC-N40
|
| JESD-609 Code |
e4
|
|
| Length |
4.9 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
40
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-30 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Supply Current-Max (Isup) |
0.09 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
20 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
5 mm
|
| Base Number Matches |
9
|
1
|
| Factory Lead Time |
|
30 Weeks
|
| Date Of Intro |
|
2017-03-08
|
|
|
|
Compare TPS2062AD with alternatives
Compare BM92A30MWV-ZE2 with alternatives