TS556CDT
vs
TS556CN
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
Micro, Plastic, So-14
|
Plastic, Dip-14
|
| Pin Count |
14
|
14
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.60
|
8542.39.00.60
|
| Additional Feature |
It Can Also Operate From A 2v, 5v And 12v Nominal Supply
|
It Can Also Operate From A 2v, 5v And 12v Nominal Supply
|
| Analog IC - Other Type |
Pulse; Rectangular
|
Pulse; Rectangular
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T14
|
| JESD-609 Code |
e4
|
e4
|
| Length |
8.65 Mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Frequency-Max |
2 Mhz
|
2 Mhz
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
DIP14,.3
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline
|
In-Line
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 Mm
|
5.1 Mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
Yes
|
No
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Commercial
|
Commercial
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
Gull Wing
|
Through-Hole
|
| Terminal Pitch |
1.27 Mm
|
2.54 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 Mm
|
7.62 Mm
|
| Base Number Matches |
1
|
1
|
|
|
|