TS68332MAB/C20
vs
MC68332ACEH20
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
THOMSON-CSF COMPSANTS SPECIFIC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
,
|
0.950 X 0.950 INCH, 0.025 INCH PITCH, PLASTIC, ROHS COMPLIANT, QFP-132
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
132
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
NXP
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
24
|
| Bit Size |
|
32
|
| CPU Family |
|
68000
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
16
|
| JESD-30 Code |
|
S-PQFP-G132
|
| JESD-609 Code |
|
e3
|
| Length |
|
24.13 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
31
|
| Number of Terminals |
|
132
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BQFP
|
| Package Equivalence Code |
|
SPQFP132,1.1SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, BUMPER
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
2048
|
| Seated Height-Max |
|
4.572 mm
|
| Speed |
|
20 MHz
|
| Supply Current-Max |
|
134 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
HCMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.635 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|
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