TS68332VA20 vs MC68332AMEH20 feature comparison

TS68332VA20 Thales Group

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MC68332AMEH20 NXP Semiconductors

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Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description , 0.950 X 0.950 INCH, 0.025 INCH PITCH, PLASTIC, ROHS COMPLIANT, QFP-132
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20.97 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-GQFP-G132 S-PQFP-G132
Number of I/O Lines 32 31
Number of Terminals 132 132
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO YES
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, BUMPER
Qualification Status Not Qualified Not Qualified
Speed 20.97 MHz 20 MHz
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS HCMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
ECCN Code EAR99
Factory Lead Time 13 Weeks
Date Of Intro 1988-01-01
Samacsys Manufacturer NXP
Boundary Scan NO
JESD-609 Code e3
Length 24.13 mm
Moisture Sensitivity Level 3
Package Code BQFP
Peak Reflow Temperature (Cel) 245
ROM Programmability ROM LESS
Seated Height-Max 4.572 mm
Terminal Finish Tin (Sn)
Terminal Pitch 0.635 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 24.13 mm

Compare TS68332VA20 with alternatives

Compare MC68332AMEH20 with alternatives