TS68C000DESC02MYA vs MC68010L12X feature comparison

TS68C000DESC02MYA Thales Group

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MC68010L12X Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description , DIP,
Pin Count 64
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 24
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 10 MHz 12.5 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-CDIP-T64 R-CDIP-T64
Number of Terminals 64 64
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Speed 10 MHz 12.5 MHz
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HCMOS MOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 3 2
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
On Chip Data RAM Width
Package Code DIP
RAM (words) 0

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