TS68C000DESC02MYA
vs
MC68010R12
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
,
|
PGA, PGA68,10X10
|
| Pin Count |
64
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
24
|
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
10 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-CDIP-T64
|
S-XPGA-P68
|
| Number of Terminals |
64
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Speed |
10 MHz
|
12.5 MHz
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
HCMOS
|
MOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Position |
DUAL
|
PERPENDICULAR
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Code |
|
PGA
|
| Package Equivalence Code |
|
PGA68,10X10
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare TS68C000DESC02MYA with alternatives