TS68C000DESC02MYA vs MC68HC000IR12F feature comparison

TS68C000DESC02MYA Thales Group

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MC68HC000IR12F Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description , DIP,
Pin Count 64
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 23
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 10 MHz 16.67 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-CDIP-T64 R-PDIP-T64
Number of Terminals 64 64
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Speed 10 MHz 16.67 MHz
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HCMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 3 2
Length 81.535 mm
Low Power Mode NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
On Chip Data RAM Width
Package Code DIP
RAM (words) 0
Seated Height-Max 5.84 mm
Supply Current-Max 50 mA
Terminal Pitch 2.54 mm
Width 22.86 mm

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Compare MC68HC000IR12F with alternatives