TS68C000DESC02MYA vs MC68HC000LC16 feature comparison

TS68C000DESC02MYA Thales Group

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MC68HC000LC16 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description , DIP,
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 23
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 10 MHz 16.67 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-CDIP-T64 R-CDIP-T64
Number of Terminals 64 64
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Speed 10 MHz 16.67 MHz
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HCMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 3 2
Length 81.28 mm
Low Power Mode NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
On Chip Data RAM Width
Package Code DIP
RAM (words) 0
Seated Height-Max 4.32 mm
Supply Current-Max 50 mA
Terminal Pitch 2.54 mm
Width 22.86 mm

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Compare MC68HC000LC16 with alternatives