TSB80C188EA20
vs
TSB80C188EB20
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LFQFP,
|
LFQFP,
|
Pin Count |
80
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
|
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
|
Address Bus Width |
20
|
20
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
8
|
8
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
Length |
12 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
2
|
|
Number of External Interrupts |
5
|
6
|
Number of Serial I/Os |
|
2
|
Number of Terminals |
80
|
80
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
1.66 mm
|
1.66 mm
|
Speed |
20 MHz
|
20 MHz
|
Supply Current-Max |
90 mA
|
108 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TSB80C188EA20 with alternatives
Compare TSB80C188EB20 with alternatives