TSC80C31-12MG/883 vs TP80C31BH-2 feature comparison

TSC80C31-12MG/883 Temic Semiconductors

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TP80C31BH-2 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS INTEL CORP
Reach Compliance Code unknown compliant
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T40 R-PDIP-T40
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
PWM Channels NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM (words) 0
ROM Programmability ROM LESS
Screening Level MIL-STD-883
Speed 12 MHz 12 MHz
Supply Current-Max 15.8 mA 25 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code DIP
Package Description DIP, DIP40,.6
Pin Count 40
HTS Code 8542.31.00.01
Additional Feature BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
CPU Family 8051
Format FIXED POINT
Integrated Cache NO
Length 52.26 mm
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os 1
Number of Timers 2
On Chip Data RAM Width 8
Package Equivalence Code DIP40,.6
RAM (bytes) 128
RAM (words) 128
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 15.24 mm

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