TSV991AIYDT
vs
MCP621T-E/MNY
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
DFN
|
| Package Description |
SOP, SOP8,.25
|
HVSON,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
20 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
Microchip
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.005 µA
|
| Bias Current-Max (IIB) @25C |
0.00001 µA
|
|
| Common-mode Reject Ratio-Min |
55 dB
|
68 dB
|
| Common-mode Reject Ratio-Nom |
78 dB
|
84 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Current-Max (IIO) |
0.0001 µA
|
|
| Input Offset Voltage-Max |
3000 µV
|
200 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4.9 mm
|
3 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
YES
|
| Micropower |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.25
|
SOLCC8,.08,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TAPE AND REEL
|
TR
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
0.8 mm
|
| Slew Rate-Nom |
10 V/us
|
10 V/us
|
| Supply Current-Max |
1.1 mA
|
3.6 mA
|
| Supply Voltage Limit-Max |
6 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Unity Gain BW-Nom |
20000
|
20000
|
| Voltage Gain-Min |
5623
|
25100
|
| Wideband |
NO
|
NO
|
| Width |
3.9 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare TSV991AIYDT with alternatives
Compare MCP621T-E/MNY with alternatives